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CVD Coating






CVD SiC & TaC Coatings | Particle-Free High-Purity for MOCVD & Epitaxy | SemiXLab Manufacturer in China – Semixlab













CVD Coating

CVD Coating

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CVD Coating Solutions – High-Purity SiC, TaC & PYC Coatings for Semiconductor Thermal Fields

Core Introduction

SemiXLab specializes in advanced chemical vapor deposition (CVD) coatings engineered for the most demanding semiconductor processes. Our CVD-SiC (silicon carbide), CVD-TaC (tantalum carbide), and PYC / PG (pyrolytic carbon / pyrolytic graphite) coatings deliver excellent film uniformity, interfacial adhesion strength, and ultra-high-purity dense structures.

These coatings protect graphite substrates used in wafer epitaxy and high-temperature corrosive environments, significantly extending component life while minimizing particle generation. Through proprietary process control and independent CVD equipment development, we achieve stable coating thickness, excellent crystal orientation uniformity, and outstanding resistance to hydrogen, ammonia, and halogen process gases.

Key advantages include high-temperature corrosion resistance, particle-free surfaces (reducing wafer contamination risk), and CTE-matched design with the substrate to ensure dimensional stability during thermal cycling. Our coatings are widely applied to MOCVD susceptors, epitaxial wafer carriers, LED / SiC / GaN film deposition platforms, and other critical thermal-field components.

Dense CVD silicon carbide coating cross-section on high-purity graphite substrate
Dense CVD silicon carbide coating cross-section on high-purity graphite substrate

Key Specifications

Parameter CVD SiC CVD TaC PG / PyC Glass Carbon
Density 3.21 g/cm³ 14.3 g/cm³ ~2.25 g/cm³ 1.42–1.54 g/cm³
Hardness 2500 HV 2000 HK 1.2 GPa 230–340 HV
Purity 99.99995% High purity ≤5 ppm High purity (low ash)
Thermal Cond. 300 W·m⁻¹·K⁻¹ 9–22 W/(m·K) — 4.6–6.3 W/(m·K)
CTE 4.5×10⁻⁶ /K 6.3×10⁻⁶ /K — 2.6–3.5×10⁻⁶ /K
Max Temp. ~2100°C (subl. 2700°C) <2500°C High Inert 2800–3000°C; air ~600°C
Typical Thickness Customizable 35±10 μm (≥20 μm) 30–100 μm 50–100 μm
Key Advantages High thermal conductivity, mature process, cost-effective Ultra-high density, extreme temp, chemical stability High purity, orientable, low hardness Gas-tight, strong corrosion resistance, low particles
Applications SiC/GaN epi, MOCVD, RTP, diffusion, high-temp heaters SiC PVT crystal growth, ultra-high-temp epi rings, thermal fields Thermal-field assist, insulation, high-purity surfaces Etch/plasma, strong corrosion, ultra-high-purity carriers

Application Scenarios

  • MOCVD epitaxial susceptors (GaN, GaAs, SiC, LED)
  • Epitaxial wafer carriers and rotating susceptors
  • LED / SiC / GaN film deposition components
  • High-temperature furnace parts, heaters, showerheads, RTP trays