Every CVD SiC / TaC‑coated part shipped, and every batch of CVD SiC Source feedstock, passes three gates—material, process, and finished product. Inspection methods align with semiconductor standards (GDMS/SIMS, CMM, SEM); packaging and logistics align with cleanliness and damage‑prevention requirements. The Zhuji base maintains a complete traceability chain from raw materials to outgoing reports.
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| Stage | Inspection Content | Purpose |
|---|---|---|
| IQC Incoming | Graphite substrate density/impurities/grain size; Source precursor & process‑media control | Control purity and consistency from the source |
| IPQC In‑Process | CNC dimensional monitoring · CVD furnace T/P · Source synthesis parameter tracking | Process parameters under control; reduce rework |
| OQC Outgoing | Coated parts: CMM · film thickness · GDMS · SEM; Source: GDMS purity · morphology · specs | Ship only when compliant; CoA with full traceability |
| Stage | Practice & Advantage |
|---|---|
| Cleaning | Ultrasonic + ultrapure water (coated parts); Source follows clean packaging protocols for particle control |
| Clean Packaging | Class 100 / Class 1000 cleanroom double‑layer vacuum nitrogen fill; Source sealed against moisture and contamination |
| Identification & Traceability | Unique serial/batch number + outgoing inspection report (CoA); Source batch number bound to GDMS data |
| Transport Protection | Shock‑ and moisture‑proof dedicated packaging (wooden crate + foam, etc.); drop‑tested per convention; global secure delivery |
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