Porous graphite
| Place of Origin: | China | |
| Brand Name: | Semixlab | |
| Model Number: | PG-001 | |
| Certification: | ISO9001 | |
| Minimum Order Quantity: | Depending on individual size (support for research and development of small batch test orders) | |
| Price: | Quote according to customized demand (large quantity discount) | |
| Packaging Details: | Air-proof anti-oxidation packaging, shock-proof wooden box (in line with international transport standards) | |
| Delivery Time: | 20-45 days (depending on customization complexity) | |
| Payment Terms: | T/T (50% in advance, 50% paid before delivery) | |
| Supply Ability: | Monthly production capacity of 3000 pieces, support urgent order production | |
Description
Porous graphite is mainly used in PVT (physical vapor transfer) silicon
carbide (SiC) single crystal growth process, is the core material of high
temperature thermal field system. The product is made of ultra-high purity
isostatically pressed graphite, which forms a uniform and controllable porous
structure through precision CNC machining and pore control technology, ensuring
excellent performance under extreme process conditions (2200℃). Its unique
design significantly improves thermal field uniformity and optimizes gas phase
transfer efficiency, which is a key guarantee for high-quality SiC crystal
growth.
Core features and process advantages:
Extreme purity and low defect rate
The vacuum high-temperature purification process (3000℃ treatment) is used to
further reduce the content of non-metallic impurities such as oxygen and
nitrogen. Eliminate impurity induced crystal defects (such as microtubules,
dislocations) to ensure the electrical performance consistency of SiC single
crystals.
Ultra high temperature stability and thermal field control
In argon/vacuum environment, it can withstand 2200℃ continuous operation for
more than 1000 hours, low coefficient of thermal expansion, and avoid material
cracking caused by thermal stress.
The porosity supports gradient distribution design, combined with CFD
simulation to optimize the pore size (10-200μm), accurately regulate the thermal
field distribution, reduce the temperature gradient fluctuation (within ±3℃),
and improve the crystal growth uniformity.
Customized solutions
Geometric adaptation: Support complex shape processing (such as annular
crucible, multi-layer shield), matching customer furnace structure.
Surface treatment: Provide ultra-precision polishing or coating services to
enhance corrosion resistance and service life.
Application performance verification
In the PVT SiC crystallization process, as a crucible and thermal field
component:
Increase crystal growth rate by 15%-20% (compared with traditional
graphite);
Wafer yield increased to more than 90% (4 inch SiC single crystal);
The maintenance period of the equipment is extended to 6 months (the usual 3
months).
Quick Detail:
1. Other names: PVT graphite crucible, silicon carbide growth with porous
graphite.
2. Application: PVT method (physical gas transport method) SiC single crystal
growth core thermal field component.
3. Core parameters: purity ≥99.9995%, porosity 15-30%, temperature resistance
2200℃ (inert gas environment), thermal conductivity 100-150 W/m·K.
Specifications
| Typical physical properties of porous graphite | |
| ltem | Parameter |
| Bulk density | 0.89 g/cm2 |
| Compressive strength | 8.27 MPa |
| Bending strength | 8.27 MPa |
| Tensile strength | 1.72 MPa |
| Specific resistance | 130Ω -inx10-5 |
| Porosity | 50% |
| Average pore size | 70um |
| Thermal Conductivity | 12W/M*K |
Applications
PVT growth furnace assembly: As part of SiC material sublimation and crystal growth, provides a stable thermal field distribution.
Thermal field shielding component: porous structure effectively reduces thermal stress and prolongs the service life of the equipment.
Seed crystal bracket: high mechanical strength to support the seed crystal, to ensure the directional growth of the crystal.
Gas diffusion layer: optimize gas phase transfer efficiency, improve single crystal quality and growth rate.
Competitive Advantage
Ultra-high temperature performance: no softening deformation at 2200℃, supporting more than 1000 hours of continuous stable operation.
Custom thermal field design: Combined with CFD simulation to optimize pore gradient, improve crystal uniformity and yield.
Fast iteration service: provide process parameter matching test and deliver prototype solution within 72 hours.
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